Intel 3210 User Manual

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 9
Introduction
upstream of airflow for a passive heatsink or at the fan inlet for
an active heatsink.
Ψ
CA
Case-to-ambient thermal solution characterization parameter
(Psi). A measure of thermal solution performance using total
package power. Defined as (T
C
- T
LA
)/Total Package Power. Heat
source size should always be specified for Ψ measurements.
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
Note: Contact your Intel field sales representative for the latest revision and order number of this document.
§
Document Title Document Number / Location
Intel
®
I/O Controller Hub9 (ICH9) Thermal Design Guidelines Contact your Intel Field Sales
Representative
Intel
®
3210 and 3200 Chipset Datasheet www.developer.intel.com
Intel
®
3210 and 3200 Chipset Specification Update www.developer.intel.com
Dual-Core Intel
®
Xeon
®
Processor 3000 Series Datasheet www.developer.intel.com
Quad-Core Intel
®
Xeon
®
Processor 3200 Series Datasheet www.developer.intel.com
BGA/OLGA Assembly Development Guide Contact your Intel Field Sales
Representative
Various system thermal design suggestions http://www.formfactors.org

Intel 3210 Specifications

General

Brand	Intel
Model	3210
Category	Motherboard
Language	English