Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 31
Thermal Metrology
Note: The target IHS temperature during reflow is 150°C ±3°C. At no time should the IHS temperature
exceed 155 °C during the solder process as damage to the device may occur.
24.Lift the solder block and magnified lens, quickly rotate the device 90 degrees
clockwise and use the back side of the tweezers to press down on the solder. This
will force out excess solder. Refer to Figure 5-20.
25.Allow the device to cool down. Blowing compressed air on the device can accelerate
the cooling time. Monitor the device IHS temperature with a handheld meter until it
drops below 70 °C before moving it to the microscope for the final steps.
5.1.4.4 Cleaning and Completion of Thermocouple Installation
26.Remove the Kapton* tape with tweezers (avoid damaging the wire insulation) and
straighten the wire to insert the remaining portion in the groove for the final gluing
process.
Note: The wire needs to be straighten in order to keep it at or below the IHS surface. Refer to
Figure 5-21.
Figure 5-20. Remove Excess Solder
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