Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 47
Mechanical Drawings
Figure B-2. Intel
®
3210 and 3200 Chipset Motherboard Component Top-Side Keep-Out
Restrictions
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORATION.
SHEET 1 OF 2DO NOT SCALE DRAWINGSCALE: NONE
1
D94910D
REVDRAWING NUMBERCAGE CODESIZE
ATX BEARLAKE MCH
HEAT SINK KEEP OUT
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
CORP.
R
PST
DEPARTMENT
NA
FINISH:
NA
MATERIAL:
DATEAPPROVED BY
DATECHECKED BY
DATECHECKED BY
03/15/07K.CEURTER
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
LINEAR 0.1MM
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
***
1
PRELIMINARY RELEASE 03/15/07
D94910 1 1
DWG. NO SHT. REV
PARTS LIST
DESCRIPTIONPART NUMBERITEM NO
QTY PER ASSY
-001-002-003
DRAWING,KO,MCH,BEARLAKEC,BONE TRAILD94910TOP
4
.1575[]
74
2.9134[]
4X 10.5
.4134[]
4X THROUGH HOLE4.04
.1591[]
81
3.189[]
60.6
2.386[]
26.79
1.055[]
45.79
1.803[]
135
48
1.890[]
67
2.638[]
DETAIL A
MAX 1.27 [.050]
COMPONENT HEIGHT
(NON-MCH COMPONENTS)
NOTES:
1 HOLE PLACEMENT FABRICATION
TOLERANCE PER INTEL 454979, CLASS 1,2,3
2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED
38.1MM ABOVE MOTHERBOARD SURFACE.
COMPONENT CENTER
NORTH
EAST
PRIMARY SIDE KEEPOUTS
MAX 25 [1.000]
COMPONENT HEIGHT
DETAIL A
SCALE 8
NO COMPONENTS THIS AREA
4X 5.06 TRACE KEEPOUT
AROUND HOLES
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