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General| Product Line | Intel Core i3 |
|---|---|
| Model Number | i3-2100 |
| Code Name | Sandy Bridge |
| Vertical Segment | Desktop |
| Base Clock Speed | 3.1 GHz |
| Cores | 2 |
| Threads | 4 |
| Cache | 3 MB Intel Smart Cache |
| TDP | 65 W |
| Socket | LGA 1155 |
| Integrated Graphics | Intel HD Graphics 2000 |
| Lithography | 32 nm |
| Bus Speed | 5 GT/s DMI |
| Max Memory Size | 32 GB |
| Max # of Memory Channels | 2 |
| Max Memory Bandwidth | 21 GB/s |
| Graphics Base Frequency | 850 MHz |
| Graphics Max Dynamic Frequency | 1.1 GHz |
| Max CPU Configuration | 1 |
| Embedded Options Available | No |
| Package Size | 37.5mm x 37.5mm |
| PCI Express Revision | 2.0 |
| PCI Express Lanes | 16 |
| Memory Types | DDR3 1066/1333 |
Details on DDR3 memory support, timing, and organization modes.
Describes the PCI Express architecture, configuration, and lane mapping.
Explains Intel VT-x and VT-d features for enhanced virtualization.
Explains how Turbo Boost dynamically increases processor frequency.
Lists supported system, processor core, and link power states.
Details Enhanced Intel SpeedStep and low-power idle (C-states) for cores.
Describes Intel RMPM, GPMT, Render C-State, and S2DDT for graphics.
References graphics thermal management features covered in Section 4.6.
Details memory channel A signals including bank select, clocks, and data bus.
Details signals for catastrophic error, thermal trip, and hot notifications.
Lists processor power rail inputs and voltage identification signals.
Details processor power and ground connections and recommendations.
Provides guidelines for proper voltage rail decoupling design.
Provides detailed DC voltage and current specifications for processor signals.
Provides pinmap diagrams and a pin list ordered by pin name.
