Datasheet, Volume 1 3
Contents
1Introduction..............................................................................................................9
1.1 Processor Feature Details ................................................................................... 11
1.1.1 Supported Technologies .......................................................................... 11
1.2 Interfaces ........................................................................................................ 11
1.2.1 System Memory Support ......................................................................... 11
1.2.2 PCI Express* ......................................................................................... 12
1.2.3 Direct Media Interface (DMI).................................................................... 13
1.2.4 Platform Environment Control Interface (PECI)........................................... 14
1.2.5 Processor Graphics ................................................................................. 14
1.2.6 Intel
®
Flexible Display Interface (Intel
®
FDI) ............................................. 14
1.3 Power Management Support ............................................................................... 15
1.3.1 Processor Core....................................................................................... 15
1.3.2 System ................................................................................................. 15
1.3.3 Memory Controller.................................................................................. 15
1.3.4 PCI Express* ......................................................................................... 15
1.3.5 Direct Media Interface (DMI).................................................................... 15
1.3.6 Processor Graphics Controller................................................................... 15
1.4 Thermal Management Support ............................................................................ 15
1.5 Package ........................................................................................................... 16
1.6 Terminology ..................................................................................................... 16
1.7 Related Documents ........................................................................................... 18
2Interfaces................................................................................................................ 19
2.1 System Memory Interface .................................................................................. 19
2.1.1 System Memory Technology Supported ..................................................... 19
2.1.2 System Memory Timing Support............................................................... 21
2.1.3 System Memory Organization Modes......................................................... 21
2.1.3.1 Single-Channel Mode................................................................. 21
2.1.3.2 Dual-Channel Mode – Intel
®
Flex Memory Technology Mode ........... 21
2.1.4 Rules for Populating Memory Slots............................................................ 22
2.1.5 Technology Enhancements of Intel
®
Fast Memory Access (Intel
®
FMA).......... 23
2.1.5.1 Just-in-Time Command Scheduling.............................................. 23
2.1.5.2 Command Overlap .................................................................... 23
2.1.5.3 Out-of-Order Scheduling............................................................ 23
2.1.6 Memory Type Range Registers (MTRRs) Enhancement................................. 23
2.1.7 Data Scrambling .................................................................................... 23
2.2 PCI Express* Interface....................................................................................... 24
2.2.1 PCI Express* Architecture ....................................................................... 24
2.2.1.1 Transaction Layer ..................................................................... 25
2.2.1.2 Data Link Layer ........................................................................ 25
2.2.1.3 Physical Layer .......................................................................... 25
2.2.2 PCI Express* Configuration Mechanism ..................................................... 26
2.2.3 PCI Express* Port................................................................................... 26
2.2.4 PCI Express* Lanes Connection................................................................ 27
2.3 Direct Media Interface (DMI)............................................................................... 27
2.3.1 DMI Error Flow....................................................................................... 27
2.3.2 Processor / PCH Compatibility Assumptions................................................ 27
2.3.3 DMI Link Down ...................................................................................... 28
2.4 Processor Graphics Controller (GT) ...................................................................... 28
2.4.1 3D and Video Engines for Graphics Processing............................................ 29
2.4.1.1 3D Engine Execution Units ......................................................... 29