Heat Sink Back Plate Drawings
100 Thermal/Mechanical Specifications and Design Guidelines
Figure E-1. Heat Sink Back Plate Keep In Zone
2X 75
2X 75
38.12
78.25
19.19
27.81
95
95
13.9
34.21
5.08
2.54
72.75
2X 37.54
26 MAX 26 MAX
2X 25.81
35.22
36
3X 5
4X 9.25
B
A
B
C
C
DEPARTMENT
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
-
TITLE
LGA 1156 & 1155 HS BACKPLATE KEEP IN
SIZE DRAWING NUMBER REV
A1
E58389_REV_B_PAE
B
SCALE:
2
DO NOT SCALE DRAWING
SHEET
1
OF
1
NOTES:
1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC
CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNS
WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS).
3. LGA 1156 & 1155 HS BACKPLATE KEEP-IN VOLUME ENCOMPASS THE BACKPLATE NOMINAL VOLUME
AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT
DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET H1 ILM BACKPLATE 4
WITH CLEARANCE MARGINS.
REFERENCE DRAWINGS:
E20847 - LGA 1156 & 1155 ILM BACKPLATE
E21320 - LGA 1156 & 1155 ILM & PROCESSOR KEEPIN
4 OUTLINE OF LGA 1156 & 1155 ILM BACKPLATE FOR REFERENCE ONLY.
5. DIMENSIONS ARE IN MILLIMETERS
1
1
1
1
4
4
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