Package Mechanical and Storage Specifications
14 Thermal/Mechanical Specifications and Design Guidelines
2.1.7 Processor Materials
Table 2-3 lists some of the package components and associated materials.
2.1.8 Processor Markings
Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 2-3. Processor Top-Side Markings
Legend:
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
Mark Text (Production Mark):
INTEL{M}{C}'08 PROC#
BRAND
SLxxx C00
SPEED/CACHE/FMB
FPO
Legend:
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
Mark Text (Engineering Mark):
INTEL{M}{C}'08
INTEL CONFIDENTIAL
Qxxx ES C00
PRODUCT CODE
FPO
e4
e4
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
LOT NO S/N