Thermal/Mechanical Specifications and Design Guidelines 97
Package Mechanical Drawings
§
Figure D-2. Processor Package Drawing (Sheet 2 of 2)
.
H
G
F
E
D
C
B
A
H
G
F
E
D
C
B
A
8 7 6 5 4 3 2
8 7 6 5 4 3 2 1
H
G
F
H
F
H
G
C
T
1
T
2
V
1
V
2
19.68
11.95
9.84
5.975
R1
R2
1.06 MAX ALLOWABLE
COMPONENT HEIGHT
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
E22526 2 6
DWG. NO SHT. REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
SIZE DRAWING NUMBER REV
A1 E22526 6
SCALE:
6
DO NOT SCALE DRAWING
SHEET
2
OF
2
D
E
0.23 C F H
JK
J
K
DETAIL
D
SCALE 20
0.23 C G H
MN
N
M
DETAIL
E
SCALE 20
SYMBOL
MILLIMETERS
COMMENTS
MIN MAX
R
1
R1.09 BASIC
R
2
R1.09 BASIC
T
1
9.75 BASIC
T
2
0.2 BASIC
V
1
9.75 BASIC
V
2
0.2 BASIC