Thermal Specifications
36 Thermal/Mechanical Specifications and Design Guidelines
Section 6.2. To ensure maximum flexibility for future processors, systems should be
designed to the Thermal Solution Capability guidelines, even if a processor with lower
power dissipation is currently planned.
Notes:
1. The package C-state power is the worst case power in the system configured as follows:
- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.
- DMI and PCIe links are at L1.
2. Specification at DTS = -50 and minimum voltage loadline.
3. Specification at DTS = -50 and minimum voltage loadline.
4. Specification at DTS = -64 and minimum voltage loadline.
5. These DTS values (in Notes 2-4) are based on the TCC Activation MSR having a value of 100, see
Section 6.2.1.
6. These values are specified at V
CC_MAX
and V
NOM
for all other voltage rails for all processor frequencies.
Systems must be designed to ensure the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CCP
exceeds V
CCP_MAX
at specified I
CCP
. Refer to the loadline specifications in the
datasheet.
7. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at DTS = -1.
TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.
8. The 2009B (09B) guidelines provide a design target for meeting all planned processor frequency
requirements. The 2009B (09B) is equivalent to the thermal requirements for the Intel
®
Core™ 2 Quad
Q9000 processor series. The 2009A (09A) is equivalent to the thermal requirements for the Intel
®
Core™ 2
Duo E8000 processor series. Reuse of those thermal solutions is recommended with the updated
mechanical attach to straddle the LGA1156 socket.
9. Not 100% tested. Specified by design characterization.
Table 6-1. Processor Thermal Specifications
Product Guidelines
8
Max
Power
Package
C1E
(W)
1,2,5,9
Max
Power
Package
C3
(W)
1,3,5,9
Max
Power
Package
C6
(W)
1,4,5,9
TTV
Thermal
Design
Power
(W)
6,7
Min
T
CASE
(°C)
Maximum
TTV TCASE
(°C)
Intel Core™ i7-800
and i5-700 desktop
processor series
(95 W)
2009B
(09B)
28 22 5.5 95 5
Figure 6-1 &
Tab le 6- 2
To Next Page
Loading...
