Package Mechanical Drawings
96 Thermal/Mechanical Specifications and Design Guidelines
Figure D-1. Processor Package Drawing (Sheet 1 of 2)
8 7 6 5 4 3 2
H
G
F
E
D
C
B
A
8 7 6 5 4 3 2 1
H
G
F
E
D
C
B
A
A
A
E
D
C
C
B
2
B
1
C
1
C
2
J
2
H
2
J
1
6X RM
1
2X M
1
2X M
2
2X M
3
F
2
F
4
D
1
G
1
H
1
G
2
C
4
C
3
0.021 SOLDER RESIST
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
E22526 1 6
DWG. NO SHT. REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
TITLE
PACKAGE MECHANICAL DRAWING
SIZE DRAWING NUMBER REV
A1 E22526 6
SCALE:
5
DO NOT SCALE DRAWING
SHEET
1
OF
2
FINISHMATERIAL
DATEAPPROVED BY
DATECHECKED BY
DATEDRAWN BY
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ± 0
ANGLES ± 0.5
THIRD ANGLE PROJECTION
C
C
C
PIN #1
SEE DETAIL
A
B
SECTION
A-A
DETAIL
A
SCALE 100
DETAIL
B
SCALE 15
IHS SEALANT
0.203 C
0.08
0.203 C
0.05
IHS LID PACKAGE
SUBSTRATE
DETAIL
C
SCALE 15
SUBSTRATE ALIGNMENT
FIDICAL
SYMBOL
MILLIMETERS
COMMENTS
MIN MAX
B
1
37.45 37.55
B
2
37.45 37.55
C
1
31.72 31.92 1 C E
C
2
33.9 34.1 1 C D
C
3
1.3 1.4
C
4
2.2 2.3
D
1
0.625
F
2
4.112 4.602
F
4
2.331 2.843
G
1
35.6616 BASIC
0.15 C D E
G
2
35.6616 BASIC
H
1
17.8308 BASIC
H
2
17.8308 BASIC
J
1
0.9144 BASIC
J
2
0.9144 BASIC
SYMBOL
MILLIMETERS
COMMENTS
MIN MAX
M
1
0.2
M
2
0.52
M
3
0.1
RM
1
0.13
0.175
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