Thermal/Mechanical Specifications and Design Guidelines 99
Heat Sink Back Plate Drawings
E Heat Sink Back Plate
Drawings
This heat sink back plate design is intended to adapt as a reference for OEMs that use
threaded fasteners on customized thermal solution, to comply with the mechanical and
structural requirements for the LGA1156 socket. The heat sink back plate does not
have to provide additional load for socket solder joint protect. Structural design
strategy for the heat sink is to provide sufficient load for the Thermal Interface Material
(TIM) and to minimize stiffness impact on the motherboard.
Note: Design modifications for specific application and manufacturing are the responsibility of
OEM and the listed vendors for customized system implementation and validation.
These vendors and devices are listed by Intel as a convenience to Intel's general
customer base, but Intel does not make any representations or warranties whatsoever
regarding quality, reliability, functionality, or compatibility of these devices. Customers
are responsible for thermal, mechanical, and environmental validation of these
solutions. This list and/or these devices may be subject to change without notice.
Please refer to the motherboard keep out zone listed in Appendix B to ensure compliant
with the heat sink back plate implementation. Figure E-1 is the heat sink back plate
keep in zone for the design implementation.
Ta b l e E-1 lists the mechanical drawings included in this appendix. Tab l e E - 2 lists the
mechanical drawings.
The enabled components may not be currently available from supplier. Contact the
supplier directly to verify time of component availability.
Table E-1. Mechanical Drawing List
Drawing Description Figure Number
“Heat Sink Back Plate Keep In Zone” Figure E-1
“Heat Sink Back Plate” Figure E-2
Table E-2. Supplier Contact Information
Supplier Contact Phone Email
CCI (Chaun Choung
Technology Corp.)
Monica Chih +886-2-29952666 x1131 monica_chih@ccic.com.tw
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