Intel Core i7-800 - Socket Standoffs and Package Seating Plane; Durability; Package Installation; Removal Features

Thermal/Mechanical Specifications and Design Guidelines 23
LGA1156 Socket
.
3.4.1 Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Appendix C.
Similarly, a seating plane on the top-side of the socket establishes the minimum
package height. See Section 5.2 for the calculated IHS height above the motherboard.
3.5 Durability
The socket must withstand 20 cycles of processor insertion and removal. The max
chain contact resistance from Tab l e 5- 4 must be met when mated in the 1st and 20th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
Figure 3-6. Package Installation / Removal Features
Pin 1
Chamfer
Package
Pin 1
Indicator
Alignment
Post
(
2 Places
)
Finger
Access
(2 Places)
Orientation
Notch
(2 Places)