Intel Core i7-800 - Page 4

4 Thermal/Mechanical Specifications and Design Guidelines
6.1.3 Thermal Metrology..................................................................................40
6.2 Processor Thermal Features ................................................................................40
6.2.1 Processor Temperature............................................................................40
6.2.2 Adaptive Thermal Monitor ........................................................................41
6.2.3 THERMTRIP# Signal ................................................................................44
6.3 Platform Environment Control Interface (PECI) ......................................................44
6.3.1 Introduction ...........................................................................................44
6.3.2 PECI Client Capabilities............................................................................45
6.3.3 Temperature Data ..................................................................................45
7 Sensor Based Thermal Specification Design Guidance ..............................................47
7.1 Sensor Based Specification Overview....................................................................47
7.2 Sensor Based Thermal Specification .....................................................................49
7.2.1 TTV Thermal Profile.................................................................................49
7.2.2 Specification When DTS value is Greater than T
CONTROL
...............................50
7.3 Thermal Solution Design Process .........................................................................51
7.3.1 Boundary Condition Definition ..................................................................51
7.3.2 Thermal Design and Modelling ..................................................................52
7.3.3 Thermal Solution Validation......................................................................52
7.4 Fan Speed Control (FSC) design process ...............................................................54
7.4.1 Fan Speed Control Algorithm without T
AMBIENT
Data ....................................54
7.4.2 Fan Speed Control Algorithm with T
AMBIENT
Data.........................................55
7.5 System Validation..............................................................................................57
7.6 Thermal Solution Characterization........................................................................58
8 ATX Reference Thermal Solution ..............................................................................59
8.1 Heatsink Thermal Solution ..................................................................................59
8.2 Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design..............60
8.3 Heatsink Mass and Center of Gravity ....................................................................60
8.4 Thermal Interface Material ..................................................................................60
9 Thermal Solution Quality and Reliability Requirements ............................................61
9.1 Reference Heatsink Thermal Verification ...............................................................61
9.2 Mechanical Environmental Testing........................................................................61
9.2.1 Recommended Test Sequence ..................................................................62
9.2.2 Post-Test Pass Criteria.............................................................................62
9.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................62
9.3 Material and Recycling Requirements....................................................................63
10 Boxed Processor Specifications................................................................................65
10.1 Introduction ......................................................................................................65
10.2 Mechanical Specifications....................................................................................66
10.2.1 Boxed Processor Cooling Solution Dimensions.............................................66
10.2.2 Boxed Processor Fan Heatsink Weight .......................................................68
10.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....68
10.3 Electrical Requirements ......................................................................................68
10.3.1 Fan Heatsink Power Supply ......................................................................68
10.4 Thermal Specifications........................................................................................69
10.4.1 Boxed Processor Cooling Requirements......................................................69
10.4.2 Variable Speed Fan .................................................................................71
A Component Suppliers ...............................................................................................73
B Mechanical Drawings ...............................................................................................75
C Socket Mechanical Drawings ....................................................................................89
D Package Mechanical Drawings .................................................................................95
E Heat Sink Back Plate Drawings ................................................................................99