Thermal/Mechanical Specifications and Design Guidelines 7
Tables
1-1 Reference Documents ..............................................................................................9
1-2 Terms and Descriptions.......................................................................................... 10
2-1 Processor Loading Specifications ............................................................................. 13
2-2 Package Handling Guidelines................................................................................... 13
2-3 Processor Materials................................................................................................ 14
2-4 Storage Conditions ................................................................................................ 16
5-1 Socket Component Mass ........................................................................................ 31
5-2 1156-land Package and LGA1156 Socket Stackup Height ............................................ 31
5-3 Socket & ILM Mechanical Specifications .................................................................... 32
5-4 Electrical Requirements for LGA1156 Socket ............................................................. 33
6-1 Processor Thermal Specifications............................................................................. 36
6-2 Thermal Test Vehicle Thermal Profile for Intel
®
Core™ i7-800 and i5-700 Desktop
Processor Series.................................................................................................... 38
6-3 Thermal Solution Performance above TCONTROL for the Intel
®
Core™ i7-800 and
i5-700 Desktop Processor Series ............................................................................. 39
6-4 Supported PECI Command Functions and Codes ........................................................ 45
6-5 Error Codes and Descriptions .................................................................................. 46
7-1 Thermal Solution Performance above T
CONTROL
.......................................................... 58
8-1 Reference Thermal Solutions................................................................................... 59
9-1 Use Conditions (Board Level) .................................................................................. 61
10-1 Fan Heatsink Power and Signal Specifications............................................................ 69
10-2 Fan Heatsink Set Points.......................................................................................... 71
A-1 Reference Heatsink Enabled Components ................................................................. 73
A-2 LGA1156 Socket and ILM Components ..................................................................... 73
A-3 Supplier Contact Information .................................................................................. 74
B-1 Mechanical Drawing List ......................................................................................... 75
C-1 Mechanical Drawing List ......................................................................................... 89
D-1 Mechanical Drawing List ......................................................................................... 95
E-1 Mechanical Drawing List ......................................................................................... 99
E-2 Supplier Contact Information .................................................................................. 99