Datasheet
103
Thermal Specifications and Design Considerations
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T
J
has been reached.
Refer to Section 6.1 for more details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser
than TDP in HFM.
6. At Tj of 105
o
C
7. At Tj of 50
o
C
8. At Tj of 35
o
C
Table 22. Power Specifications for the Dual-Core Low Power Standard Voltage
Processors (25W) in Standard Package
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit Notes
TDP
P9700
P9600
P8800
P9500
P8700
P8600
P8400
2.8 GHz & V
CCHFM
2.667 GHz & V
CCHFM
2.667 GHz & V
CCHFM
2.53 GHz & V
CCHFM
2.53 GHz & V
CCHFM
2.4 GHz & V
CCHFM
2.267 GHz & V
CCHFM
1.6 GHz & V
CCLFM
0.8 GHz & V
CCSLFM
25
25
25
25
25
25
25
20
11
W
1, 4,
5, 6
Symbol Parameter Min Typ Max Unit Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at V
CCHFM
at V
CCSLFM
——8.1
3.7
W2, 5, 7
P
SLP
Sleep Power
at V
CCHFM
at V
CCSLFM
——7.3
3.5
W2, 5, 7
P
DSLP
Deep Sleep Power
at V
CCHFM
at V
CCSLFM
——2.9
2.1
W2, 5, 8
P
DPRSLP
Deeper Sleep Power — — 1.0 W 2, 8
P
DC4
Intel® Enhanced Deeper Sleep State Power — — 0.9 W 2, 8
P
C6
Intel® Deep Power Down Power — — 0.3 W 2, 8
T
J
Junction Temperature 0 — 105 °C3, 4
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