Intel P8700 - Core 2 Duo Processor - 12 3-MB die Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)

Package Mechanical Specifications and Pin Information
Datasheet 55
Figure 12. 3-MB Die Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)
B6741-01
D93702(1)
TOP VIEW
FRONT VIEW
SIDE VIEW
BOTTOM VIEW
DETAIL
B
SCALE 50
DETAIL
A
SCALE 20
F
3
0.203
F
2
C
Package
Substrate
Underfill
Die
N
SEE DETAIL
A
SEE DETAIL
B
479 BALLS
B
A
B
2
B
1
C
2
C
1
H
2
J
1
J
2
G
2
H
1
G
1
B
1
34.95 34.95 35.05
1.937 2.207
0.61 0.69
35.05
SYMBOL
COMMENTS
MILLIMETERS
MIN MAX
B
2
9.4
C
2
8.7
C
1
0.88
F
2
31.75 BASIC
G
2
31.75 BASIC
G
1
15.875 BASIC
H
2
15.875 BASIC
H
1
W
M
6g
N
0.6 0.8
1.27 BASIC
J
2
1.27 BASIC
J
1
F
3
ø0.203
CA
L
B
ø0.071
ø
M
L