Intel P8700 - Core 2 Duo Processor - 10 3-MB die Micro-FCPGA Processor Package Drawing (Sheet 1 of 2)

Package Mechanical Specifications and Pin Information
Datasheet 53
Figure 10. 3-MB die Micro-FCPGA Processor Package Drawing (Sheet 1 of 2)
B6739-01
D76564(1)
TOP VIEW
FRONT VIEW
SIDE VIEW
BOTTOM VIEW
F
3
F
2
C
Package Substrate
Underfill
Die
A
478 PINS
B
A
B
2
B
1
C
2
C
1
H
2
J
1
J
2
G
2
H
1
G
1
B
1
34.95 34.95 35.05
1.742 1.962
0.255 0.355
35.05
SYMBOL
COMMENTS
MILLIMETERS
MIN MAX
B
2
9.4
C
2
8.7
C
1
0.88
F
2
31.75 BASIC
G
2
31.75 BASIC
G
1
15.875 BASIC
H
2
15.875 BASIC
H
1
W
P
6g
Keying Pins A1, A2
1.27 BASIC
J
2
1.27 BASIC
J
1
F
3
ø
P
0.65 MAX
ø0.65 MAX
ø0.37 MAX
2.03±0.08
ø
0.356
C C
A
M
B
ø
0.254
M
DETAIL
A
SCALE 20