Thermal Specifications and Design Considerations
104 Datasheet
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is not the
maximum theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum T
J
has been reached.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM.
6. At Tj of 105
o
C
7. At Tj of 50 °C
8. At Tj of 35
o
C
Table 23. Power Specifications for the Dual-Core Power Optimized Performance (25 W)
SFF Processors
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit Notes
TDP
SP9600
SP9400
SP9300
2.53 GHz & HFM V
CC
2.4 GHz & HFM V
CC
2.26 GHz & HFM V
CC
1.6 GHz & Super LFM V
CC
0.8 GHz & Super LFM V
CC
25
25
25
20
11
W
1, 4, 5,
6
Symbol Parameter Min Typ Max Unit Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at V
CCHFM
at V
CCSLFM
——8.3
3.3
W2, 5, 7
P
SLP
Sleep Power
at V
CCHFM
at V
CCSLFM
——7.5
3.1
W2, 5, 7
P
DSLP
Deep Sleep Power
at V
CCHFM
at V
CCSLFM
——2.9
1.8
W2, 5, 8
P
DPRSLP
Deeper Sleep Power — — 1.0 W 2, 8
P
DC4
Intel® Enhanced Deeper Sleep State Power — — 0.9 W 2, 8
P
C6
Intel® Deep Power Down Power — — 0.3 W 2, 8
T
J
Junction Temperature 0 — 105 °C3, 4
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