Intel P8700 - Core 2 Duo Processor - 11 3-MB die Micro-FCPGA Processor Package Drawing (Sheet 2 of 2)

Package Mechanical Specifications and Pin Information
54 Datasheet
Figure 11. 3-MB Die Micro-FCPGA Processor Package Drawing (Sheet 2 of 2)
B6740-01
D76564(2)
TOP VIEW
SIDE VIEW
BOTTOM VIEW
CORNER KEEP OUT
ZONE 4X
EDGE KEEP OUT
ZONE 4X
4X 7.00
4X 5.00
4X 7.00
13.97
6.985
13.97
6.985
1.625
1.5 MAX ALLOWABLE
COMPONENT HEIGHT
1.625
ø0.406
C C
A
M
B
ø0.254
ø
0.305±0.25
M