Intel P8700 - Core 2 Duo Processor Datasheet

Introduction
8 Datasheet
• Digital thermal sensor (DTS)
• Intel® 64 architecture
• Supports enhanced Intel® Virtualization Technology
• Enhanced Intel® Dynamic Acceleration Technology and Enhanced Multi-Threaded
Thermal Management (EMTTM)
• Supports PSI2 functionality
• SV processor offered in Micro-FCPGA and Micro-FCBGA packaging technologies
• Processor in POP, LV and ULV are offered in Micro-FCBGA packaging technologies
only
• Execute Disable Bit support for enhanced security
• Intel® Deep Power Down low-power state with P_LVL6 I/O support
• Support for Intel® Trusted Execution Technology
• Half ratio support (N/2) for core to bus ratio
1.1 Terminology
Term Definition
#
A “#” symbol after a signal name refers to an active low signal, indicating a
signal is in the active state when driven to a low level. For example, when
RESET# is low, a reset has been requested. Conversely, when NMI is high,
a nonmaskable interrupt has occurred. In the case of signals where the
name does not imply an active state but describes part of a binary
sequence (such as address or data), the “#” symbol implies that the signal
is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and D[3:0]#
= “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level).
Front Side Bus
(FSB)
Refers to the interface between the processor and system core logic (also
known as the chipset components).
AGTL+
Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+
signaling technology on some Intel processors.
Storage
Conditions
Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor landings should not
be connected to any supply voltages, have any I/Os biased or receive any
clocks. Upon exposure to “free air” (i.e., unsealed packaging or a device
removed from packaging material) the processor must be handled in
accordance with moisture sensitivity labeling (MSL) as indicated on the
packaging material.
Enhanced Intel
SpeedStep®
Technology
Technology that provides power management capabilities to laptops.
Processor Core
Processor core die with integrated L1 and L2 cache. All AC timing and signal
integrity specifications are at the pads of the processor core.

Intel P8700 - Core 2 Duo Processor Specifications

General

Processor Number	P8700
Number of Cores	2
Threads	2
Clock Speed	2.53 GHz
Cache	3 MB L2 Cache
Bus Speed	1066 MHz
TDP	25 W
Lithography	45 nm
Socket	PGA478
Instruction Set	64-bit
Max Memory Size	8 GB
Max Memory Channels	2
Max Memory Bandwidth	17.1 GB/s
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes
Idle States	Yes
Enhanced Intel SpeedStep Technology	Yes
Package Size	35mm x 35mm
Intel 64	Yes
Intel Trusted Execution Technology	No
AES New Instructions	No
Virtualization Technology	VT-x
Memory Types	DDR3