5.3
General Repair Procedures and Techniques
Environmentally Preferred Products (EPP) were developed and assembled using environmentally
preferred components and solder assembly techniques to comply with the European Union's
Restriction of Hazardous Substances (ROHS 2) Directive 2011/65/EU and Waste Electrical and
Electronic Equipment (WEEE) Directive 2012/19/EU. To maintain product compliance and reliability,
use only the Motorola Solutions specified parts in this manual.
For the identification of lead (Pb) free assemblies, all EPP products carry the EPP Marking, shown in
the following examples, on the Printed Circuit Board (PCB). This marking provides information to those
performing assembly, servicing, and recycling operation on this product, adhering to the JEDEC
Standard No. 97. The EPP Marking takes the form of a label or marking on the PCB.
Any rework or repair on Environmentally Preferred Products must be done using the appropriate lead-
free solder wire and lead-free solder paste as stated in the following tables:
Table 14: Lead Free Solder Wire Part Number List
Motorola
Solutions
Part Number
Alloy Flux Type Flux Content
by Weight
Melting
Point
Suppli-
er Part
number
Diame-
ter
Weight
1088929Y01 95.5Sn/3.8Ag/
0.7Cu
RMA Version 2.7–3.2% 217 °C 52171 0.015
in.
1 lb
spool
Table 15: Lead Free Solder Paste Part Number List
Motorola
Solutions
Part Number
Manufacturer
Part Number
Viscosity Type Composition
and Percent
Metal
Liquid Tem-
perature
1085674C03 NC-SMQ230 900–1000KCPs
Brookfield (5
rpm)
Type 3
(-325/+500)
(95.5%Sn-3.8%A
g-0.7%Cu) 89.3%
217 °C
Parts Replacement and Substitution
When damaged parts are replaced, identical parts must be used. If the identical replacement part is not
locally available, check the parts list for the proper Motorola Solutions part number and order the part.
Rigid Circuit Boards
This family of radios use bonded, multi-layer, printed circuit boards. Since the inner layers are not
accessible, some special considerations are required when soldering and unsoldering components.
The plated-through holes may interconnect multiple layers of the printed circuit. Therefore, exercise
care to avoid pulling the plated circuit out of the hole.
When soldering near a connector:
MN002952A01-AH
Chapter 5: Maintenance
67
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