• Avoid accidentally getting solder in the connector.
• Be careful not to form solder bridges between the connector pins.
• Examine your work closely for shorts due to solder bridges.
For soldering components with Hot-Air or infra red solder systems, check the user guide of your solder
system to get information on solder temperature and time for the different housings of the integrated
circuits and other components.
5.4
Pre-baking of Integrated Circuits
Electronic components are generally coated with plastic material which has the nature of not being
waterproof. If kept unsealed, the components can absorb humidity.
When soldered to the board (especially with reflow techniques) the sudden change in temperature can
cause fissures or cracks that can result in malfunction or damage.
To avoid this problem, these Moisture Sensitive (MS) components must be stored and shipped in a
sealed wrapping (dry pack). Processing must take place only with dry components when uninterrupted
dry storage can be guaranteed, otherwise the components must be pre-baked.
If a reflow procedure takes place close to MS components, the whole board must be pre-baked.
Table 16: Moisture Sensitivity Levels (MSL)
Part Number MSL Description
5166554A01 3 ADDAG
5186988J77 3 JAVELIN
5185956E43 2A FLASH 16 MB
5185963A85 3 ABACUS AD9874
5166541A01 3 Patriot ROM3
5189233U61 3 PSRAM 4 MB
5199434A01 2 Serial SPI EEPROM
Part Number Moisture Sensitivity
Level (MSL)
1
Description
51009877001
2
3 RFIC, U200_W
5186988J77 3 Tx Power Control IC, U600_Y
5108683Y44
3
3 TETRA PA, U702_Y, U703_Y, U704_Y
3
IC000326A01 3 Power Management IC 4.1, U6010_B
51012475004 3 Dual Core Processor 2.3, U4020_A
1
Out of dry package MSL:
• 1 – No dry pack required
• 2 – One year
• 3 – 168 hours
2
New parts replacement. Use older parts until depletion.
3
This part is offered for 800 MHz radio models only.
MN002952A01-AH
Chapter 5: Maintenance
68
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