LTE-A Module  Series 
                                                            EM120R-GL&EM160R-GL Hardware Design 
EM120R-GL&EM160R-GL_Hardware_Design                                                                         65  / 79 
 
 
 
6.3. I/O Requirements 
 
Table 36: I/O Requirements 
 
 
1. 
1) 
Within operating temperature range, the module is 3GPP compliant. For those end devices with bad 
thermal dissipation condition, a thermal pad or other thermal conductive components may be required 
between the module and main PCB to achieve the full operating temperature range. 
2. 
2) 
Within extended temperature range, the module remains the ability to establish and maintain a 
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There 
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like