LTE-A Module Series
EM120R-GL&EM160R-GL Hardware Design
EM120R-GL&EM160R-GL_Hardware_Design 65 / 79
6.3. I/O Requirements
Table 36: I/O Requirements
1.
1)
Within operating temperature range, the module is 3GPP compliant. For those end devices with bad
thermal dissipation condition, a thermal pad or other thermal conductive components may be required
between the module and main PCB to achieve the full operating temperature range.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like