LTE-A Module Series
EM120R-GL&EM160R-GL Hardware Design
EM120R-GL&EM160R-GL_Hardware_Design 14 / 79
2.3. Functional Diagram
The following figure shows a block diagram of EM120R-GL&EM160R-GL.
1.
1)
Within operating temperature range, the module is 3GPP compliant. For those end devices with
bad thermal dissipation condition, a thermal pad or other thermal conductive components may be
required between the module and main PCB to achieve the full operating temperature range.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like Pout might reduce in their values and exceed the specified tolerances. When the temperature
returns to normal operating temperature level, the module will meet 3GPP specifications again.
3. “*” means under development.
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