Quectel RG520N-AT - Recommended Footprint

5G Module Series
RG520N-AT_Hardware_Design 91 / 109
7.2. Recommended Footprint
Figure 50: Recommended Footprint
.
1. Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.
2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least
1.2 mm.
NOTE
Pin 1