Connecting
6.3 Equipotential bonding
SIMATIC Rack PC 547B
Operating Instructions, 12/2007, A5E01127519-02
33
6.3 Equipotential bonding
A low-impedance ground connection improves the discharge of interference generated by
external power cables, signal cables or cables for I/O modules to ground.
Equipotential bonding terminal
The equipotential bonding terminal (1) on the device
(large surface, large-area contact) must be
interconnected with the central grounding busbar of
the cabinet or plant in which the PC is to be installed.
The minimum conductor cross-section may not be
less than 5 mm
2
.
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