Texas Instruments CC2500 - Package Description (QFN 20); Recommended PCB Layout for Package (QFN 20); Soldering Information

CC2500
S
WRS040
C
Page
85
of
89
33
Package Description (Q
FN
20)
33.1
Recommended PCB
L
ayout for
P
ack
age (Q
FN
20)
Figure
30
: Recommended PCB
L
ayout for Q
FN
20
P
ackage
Note: The figure is an illustration only and not to scale. There are five
10
mil diameter via holes
distributed symmetrically in the ground pad under the package.
See also the
CC2500
EM
reference design
[4]
.
33.2
Soldering
I
nformation
The recommendations for lead
-
free reflow in
IPC/
JEDE
J
-
STD
-
020
D
should be foll
owed.