70
Important information on setting the parameters
for the heating/cooling circuits
■
The number of heating/cooling circuits available
depends on the type of heat pump and on the sys-
tem configuration.
–
System without external buffer cylinder:
1 or 2 heating/cooling circuits directly connected to
the indoor unit
–
System with external buffer cylinder:
Up to 4 heating/cooling circuits connected to the
external buffer cylinder
■
The type of cooling circuit is configured in the com-
missioning assistant, e.g. cooling via underfloor heat-
ing circuit, cooling via fan convectors, etc.
Temperature adjustment is dependent on the selec-
ted type of cooling circuit. For cooling via fan convec-
tors, for example, the set flow temperature can be
set to a lower value than for cooling via underfloor
heating circuits.
897 Screed drying
897.0 Screed drying
Selection of profiles for screed drying:
Screed drying starts straight away and affects all heat-
ing circuits.
Set speed of the secondary pump during screed dry-
ing: Parameter 1100.2
Note
If screed drying is interrupted (e.g. due to a power cut),
screed drying resumes automatically from the last
position once the heat pump control unit has been
restarted.
Value Meaning
0 No screed drying or end screed drying.
1 Temperature/time profile 1 (in acc. with
EN 1264-4)
t/d
ϑ
/°C
1 5 10 15 20 25 30
10
20
30
40
50
2 Temperature/time profile 2 (in acc. with ZV
parquet and flooring technology)
t/d
ϑ
/°C
1 5 10 15 20 25 30
10
20
30
40
50
Value Meaning
3 Temperature/time profile 3 (in acc. with
Austrian Standards)
ϑ
/°C
t/d
1 5 10 15 20 25 30
10
20
30
40
50
4 Temperature/time profile 4
t/d
ϑ
/°C
1 5 10 15 20 25 30
10
20
30
40
50
5 Temperature/time profile 5
1 5 10 15 20 25 30
10
20
30
40
50
t/d
ϑ
/°C
6 Temperature/time profile 6
1 5 10 15 20 25 30
10
20
30
40
50
ϑ
/°C
t/d
Parameter group for heating/cooling circuit
Notes
6218234
Parameter
To Next Page
Loading...
