Rockwell Automation Publication 2097-UM002D-EN-P - April 2017 59
Connect the Kinetix 350 Drive System Chapter 4
Figure 34 - Chassis Ground Configuration (Multiple Kinetix 350 Drives on One Panel)
Ground Multiple Subpanels
To ground multiple subpanels, refer to the Figure 35 HF bonding is not
illustrated. For information, see Bonding Multiple Subpanels
on page 26.
Figure 35 - Subpanels Connected to a Single Ground Point
Bonded Ground Bar
(optional)
Bonded Cabinet
Ground Bus
Ground Grid or Power
Distribution Ground
Always follow NEC and
applicable local codes.
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Always follow NEC and
applicable local codes.
Ground Grid or Power
Distribution Ground
Bonded Ground
Bus
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