Micropilot FMR60B PROFINET with Ethernet-APL
38 Endress+Hauser
Encapsulated antenna, PVDF, 40 mm (1.5 in)
Process connection thread 1-½"
Seal T
p
Process pressure range
A0047831
PVDF encapsulated –40 to +80 °C
(–40 to +176 °F)
–1 to 3 bar (–14.5 to 43.5 psi)
PVDF encapsulated –40 to +130 °C
(–40 to +266 °F)
–1 to 3 bar (–14.5 to 43.5 psi)
The following temperature restriction applies for devices with the dust ignition-proof
approval category 1D, 2D or 3D
PVDF encapsulated –20 to +80 °C (–4 to +176 °F) –1 to 3 bar (–14.5 to 43.5 psi)
Process connection UNI flange PP
Seal T
p
Process pressure range
A0047947
PVDF encapsulated –40 to +80 °C
(–40 to +176 °F)
–1 to 3 bar (–14.5 to 43.5 psi)
The following temperature restriction applies for devices with the dust ignition-proof
approval category 1D, 2D or 3D
PVDF encapsulated –20 to +80 °C (–4 to +176 °F) –1 to 3 bar (–14.5 to 43.5 psi)
The pressure range may be further restricted in the event of a CRN approval.
Drip-off antenna 50 mm (2 in)
Process connection thread
Seal T
p
Process pressure range
A0047447
FKM Viton GLT –40 to +130 °C (–40 to +266 °F) –1 to 16 bar (–14.5 to 232 psi)
FKM Viton GLT –40 to +150 °C (–40 to +302 °F) –1 to 16 bar (–14.5 to 232 psi)
FKM Viton GLT –40 to +200 °C (–40 to +392 °F) –1 to 16 bar (–14.5 to 232 psi)
EPDM –40 to +130 °C (–40 to +266 °F) –1 to 16 bar (–14.5 to 232 psi)
HNBR –20 to +150 °C (–4 to +302 °F) –1 to 16 bar (–14.5 to 232 psi)
FFKM Kalrez –20 to +150 °C (–4 to +302 °F) –1 to 16 bar (–14.5 to 232 psi)
FFKM Kalrez –20 to +200 °C (–4 to +392 °F) –1 to 16 bar (–14.5 to 232 psi)
Process connection UNI flange PP
Seal T
p
Process pressure range
A0047726
FKM Viton GLT –40 to +80 °C (–40 to +176 °F) –1 to 3 bar (–14.5 to 43.5 psi)
EPDM –40 to +80 °C (–40 to +176 °F) –1 to 3 bar (–14.5 to 43.5 psi)
The following temperature restriction applies for devices with the HNBR or FFKM
Kalrez O-ring
HNBR –20 to +80 °C (–4 to +176 °F) –1 to 3 bar (–14.5 to 43.5 psi)
FFKM Kalrez –20 to +80 °C (–4 to +176 °F) –1 to 3 bar (–14.5 to 43.5 psi)