Fritsch ANALYSETTE 3 - Setting Sieving Parameters

Do not switch o the device during this work. When the
de
vice is switched o, the sample material can sck or
glue to the sieves.
Transfer (rinse) the sieve residue into weighed boles and dry it.
No
w the lower sieves can be sieved further. Connue dismantling as
described above.
NOTICE!
The sie
ve stack must remain lled with liquid during the
enre sieving process.
The sieve foils must not run dry!
That can cause irreparable damage to the sieves.
Torn sieve foils can be soldered with so solder, point by
poin
t from underneath.
6.5 Standby
If the device is not operated for approx. one hour, it switches to energy-
sa
ving mode (STANDBY). Only the STANDBY lamp lights up.
The device is switched to normal mode by pressing the START key. The
POWER lamp lights up, the STANDBY lamp goes out.
6.6 Seng the sieving me
The sieving me can be set in increments of minutes using the +/- keys.
Values between 1 and 99 minutes are possible; aer a sieving me of 1
hour, let the device cool down.
Connuous operaon is set by holding down the "-" key unl "P" or "00"
appears on the display.
Using the device
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