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HP Engage Flex Pro G2 - Page 35

HP Engage Flex Pro G2
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Table 4-2 System speed factors
Module configuration Description of configuration Maximum memory speed*
Single DIMM per channel Configurations with only 1 or 2 DIMM
modules installed only in black slots
4400 Mbps
Two single-ranked DIMMs in a channel Configurations with 3 or 4 single ranked
DIMMs (8 GB and 16 GB) installed
4000 Mbps
Two dual-ranked DIMMs in a channel Configurations with 3 or 4 dual-ranked
DIMMs (32 GB) installed
3600 Mbps
* Actual memory speed is dependent on the processor.
Recommendations for upgrading memory
To make sure that the system can run at maximum speed:
Use the same capacity memory that is already installed in the computer.
Buy modules in pairs.
Move similar modules into the same channel (memory slots 1 and 2) and install new modules
together in the second channel (slots 3 and 4).
Memory features
Single-bit errors are automatically corrected.
Detected multi-bit errors cause the system to immediately reboot and halt with an F1 prompt error
message.
NOTE: Although HP does support non-ECC memory on this platform, non-ECC memory does not fully
detect or correct single-bit or multi-bit errors, which can cause instability or corruption of data in the
platform.
Loading rules
Each channel includes two sockets. Load DIMM slots 1 and 3 first, then 2 and 4. Do not load slot 2
unless slot 1 is loaded. Do not load slot 4 unless slot 3 is loaded.
If mixing dual-ranked and single-ranked DIMMs, load the dual-ranked DIMMs in a slots 1 and 2 and
load single-ranked DIMMs in slots 3 and 4.
NOTE: Single-channel and unbalanced dual-channel memory configurations results in inferior
graphics performance.
IMPORTANT: You must disconnect the power cord and wait approximately 30 seconds for the power
to drain before adding or removing memory modules. Regardless of the power state, voltage is always
supplied to the memory modules as long as the computer is plugged into an active AC outlet. Adding or
removing memory modules while voltage is present can cause irreparable damage to the memory
modules or system board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is
important to use memory modules with gold-plated metal contacts to prevent corrosion, oxidation, or
both resulting from having incompatible metals in contact with each other.
28
Chapter 4 Removal and replacement procedures

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