Intel 2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 User Manual

Electrical Specifications
100 Datasheet, Volume 1
Notes:
1. Unless otherwise noted, all specifications in this table are based on post-silicon estimates and simulations
or empirical data.
2. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power or thermal management event
(Intel Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).
3. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the
socket with a 100-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-M minimum
impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external
noise from the system is not coupled into the oscilloscope probe.
4. PSx refers to the voltage regulator power state as set by the SVID protocol.
5. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power or thermal management event
(Intel Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).
Table 7-10. Processor Graphics (V
AXG
) Supply DC Voltage and Current Specifications
Symbol Parameter Min Typ Max Unit Note
1
GFX_VID
Active VID Range for V
AXG
XE, SV-QC, SV-DC
LV
ULV
0.65
0.65
0.65
—
1.35
1.35
1.35
V2, 3
VAXG Processor Graphics core voltage 0 – 1.52 V
I
CCMAX_VAXG
Max Current for Processor Graphics
Rail
XE, SV-QC, SV-DC (GT2)
SV-DC (GT1)
LV (GT2)
ULV (GT2)
ULV (GT1)
——
33
24
33
26
16
A
I
CCTDC_VAXG
Thermal Design Current (TDC) for
Processor Graphics Rail
XE, SV-QC, SV-DC (GT2)
SV-DC (GT1)
LV (GT2)
ULV (GT2)
ULV (GT1)
——
21.5
20
21.5
10
8
A
TOL
AXG
V
AXG
Tole ranc e PS0 ,PS 1 — ±15 m V 4
PS2,PS3 — ±11.5 mV 4
Ripple
Ripple Tolerance PS0, PS1 — ±18 mV 4
PS2 — -7.5/+18.5 mV 4
PS3 — -7.5/+27.5 mV
LL
AXG
V
AXG
Loadline
GT2 based units
GT1 based units
-3.9
-4.6
m

Intel 2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 Specifications

General

Brand	Intel
Model	2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011
Category	Computer Hardware
Language	English