Datasheet, Volume 1 13
Introduction
1.1 Processor Feature Details
• Four or two execution cores
• A 32-KB instruction and 32-KB data first-level cache (L1) for each core
• A 256-KB shared instruction/data second-level cache (L2) for each core
• Up to 8-MB shared instruction/data third-level cache (L3), shared among all cores
1.1.1 Supported Technologies
•Intel
®
Virtualization Technology for Directed I/O (Intel
®
VT-d)
•Intel
®
Virtualization Technology (Intel
®
VT-x)
•Intel
®
Active Management Technology 7.0 (Intel
®
AMT 7.0)
•Intel
®
Trusted Execution Technology (Intel
®
TXT)
•Intel
®
Streaming SIMD Extensions 4.1 (Intel
®
SSE4.1)
•Intel
®
Streaming SIMD Extensions 4.2 (Intel
®
SSE4.2)
•Intel
®
Hyper-Threading Technology
•Intel
®
64 Architecture
• Execute Disable Bit
•Intel
®
Turbo Boost Technology
•Intel
®
Advanced Vector Extensions (Intel
®
AVX)
• Advanced Encryption Standard New Instructions (AES-NI)
• PCLMULQDQ Instruction
1.2 Interfaces
1.2.1 System Memory Support
• Two channels of DDR3 memory with a maximum of one SO-DIMM per channel
• Single-channel and dual-channel memory organization modes
• Data burst length of eight for all memory organization modes
• Memory DDR3 data transfer rates of 1066 MT/s, 1333 MT/s, and 1600 MT/s
• 64-bit wide channels
• DDR3 I/O Voltage of 1.5 V
• Non-ECC, unbuffered DDR3 SO-DIMMs only
• Theoretical maximum memory bandwidth of
— 17.1 GB/s in dual-channel mode assuming DDR3 1066 MT/s
— 21.3 GB/s in dual-channel mode assuming DDR3 1333 MT/s
— 25.6 GB/s in dual-channel mode assuming DDR3 1600 MT/s
• 1Gb, 2Gb, and 4Gb DDR3 DRAM technologies are supported for x8 and x16
devices.
— Using 4Gb device technologies, the largest memory capacity possible is 16 GB,
assuming dual-channel mode with two x8, dual-ranked, un-buffered, non-ECC,
SO-DIMM memory configuration.
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