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Intel 2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 User Manual

Intel 2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011
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Electrical Specifications
96 Datasheet, Volume 1
Notes:
1. Refers to a component device that is not assembled in a board or socket and is not electrically connected to
a voltage reference or I/O signal.
2. Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount
reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
3. T
absolute storage
applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags, or desiccant.
4. Component product device storage temperature qualification methods may follow JESD22-A119 (low temp)
and JESD22-A103 (high temp) standards when applicable for volatile memory.
5. Intel branded products are specified and certified to meet the following temperature and humidity limits
that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C and Humidity: 50%
to 90%, non-condensing with a maximum wet bulb of 28 °C.) Post board attach storage temperature limits
are not specified for non-Intel branded boards.
6. The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
7. Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
sustained storage
and customer shelf life in applicable Intel boxes and bags.
7.9 DC Specifications
The processor DC specifications in this section are defined at the processor
pins, unless noted otherwise. See Chapter 8 for the processor pin listings and
Chapter 6 for signal definitions.
The DC specifications for the DDR3 signals are listed in Ta b le 7-11. Control
Sideband and Test Access Port (TAP) are listed in Tab l e 7-12.
Ta ble 7-5 lists the DC specifications for the processor and are valid only while
meeting specifications for junction temperature, clock frequency, and input
voltages. Care should be taken to read all notes associated with each parameter.
AC tolerances for all DC rails include dynamic load currents at switching frequencies
up to 1 MHz.
Table 7-4. Storage Condition Ratings
Symbol Parameter Min Max Notes
T
absolute storage
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when exceeded for any length of
time.
-25 °C 125 °C 1, 2, 3, 4
T
sustained storage
The ambient storage temperature (in
shipping media) for a sustained period of time
-5 °C 40 °C 5, 6
T
short term storage
The ambient storage temperature (in
shipping media) for a short period of time.
-20 °C 85 °C
RH
sustained storage
The maximum device storage relative
humidity for a sustained period of time.
60% at 24 °C 6, 7
Time
sustained storage
A prolonged or extended period of time;
typically associated with customer shelf life.
0 Months 30 Months 7
Time
short term storage
A short-period of time; 0 hours 72 hours

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Intel 2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 Specifications

General IconGeneral
BrandIntel
Model2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011
CategoryComputer Hardware
LanguageEnglish

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