Intel 3210

4 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
5-9 Detailed Thermocouple Bead Placement................................................................25
5-10 Tapes Installation ..............................................................................................25
5-11 Placing Thermocouple Bead into the Bottom of the Groove ......................................26
5-12 Second Tape Installation.....................................................................................26
5-13 Measuring Resistance between Thermocouple and IHS............................................27
5-14 Adding a Small Amount of Past Flux to the Bead for Soldering .................................27
5-15 Cutting Solder...................................................................................................28
5-16 Positioning Solder on IHS....................................................................................28
5-17 Solder Block Setup.............................................................................................29
5-18 Observing the Solder Melting...............................................................................30
5-19 Pushing Solder Back into the End of Groove ..........................................................30
5-20 Remove Excess Solder........................................................................................31
5-21 Thermocouple Placed into Groove ........................................................................32
5-22 Remove Excess Solder........................................................................................32
5-23 Fill Groove with Adhesive....................................................................................33
5-24 Finished Thermocouple Installation.......................................................................34
6-1 Reference Heatsink Measured Thermal Performance vs. Approach Velocity ................36
6-2 Design Concept for Reference Thermal Solution .....................................................37
6-3 Heatsink Extrusion Profiles..................................................................................37
6-4 Reference Thermal Solution Assembly Process - Heatsink Sub-Assembly (Step 1).......39
6-5 Reference Thermal Solution Assembly Process - Heatsink Assembly (Step 2) .............40
B-1 Intel® 3210 and 3200 Chipset Package Drawing....................................................46
B-2 Intel® 3210 and 3200 Chipset Motherboard Component
Top-Side Keep-Out Restrictions ...........................................................................47
B-3 Intel® 3210 and 3200 Chipset Motherboard Component
Back-Side Keep-Out Restrictions..........................................................................48
B-4 Intel® 3210 and 3200 Chipset Reference Thermal Solution Assembly.......................49
B-5 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Heatsink Drawing..........50
B-6 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Spring Preload Clip........51
B-7 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut ................52
B-8 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (1 of 2)............53
B-9 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (2 of 2)............54
B-10 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Backplate Assembly ......55
B-11 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Backplate.....................56
B-12 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Insulator......................57
B-13 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Flush Mount Stud..........58
Tables
3-1 Intel® 3210 Chipset Thermal Specifications ..........................................................15
3-2 Intel® 3200 Chipset Thermal Specifications ..........................................................15
5-1 Thermocouple Attach Support Equipment..............................................................19
6-1 Honeywell PCM45F* TIM Performance as a Function of Attach Pressure.....................38
6-2 Reference Thermal Solution Environmental Reliability Guidelines..............................41