Intel 5100 Series User Manual

Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 81
Quality and Reliability Requirements
D Quality and Reliability
Requirements
D.1 Intel Verification Criteria for the Reference
Designs
D.1.1 Reference Heatsink Thermal Verification
The Intel reference heatsinks will be verified within specific boundary conditions using a
TTV and the methodology described in the Intel
®
Xeon
®
Processor Family Thermal Test
Vehicle User's Guide.
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3σ value for thermal characterization parameter using real processors (based on the
TTV correction offset).
D.1.2 Environmental Reliability Testing
D.1.2.1 Structural Reliability Testing
The Intel reference heatsinks will be tested in an assembled condition, along with the
LGA771 Socket. Details of the Environmental Requirements, and associated stress
tests, can be found in the LGA771 Socket Mechanical Design Guide.
The use condition environment definitions provided in Table D-1 are based on
speculative use condition assumptions, and are provided as examples only.

Intel 5100 Series Specifications

General

Wireless Protocol	802.11a/b/g/n
Frequency Band	2.4 GHz, 5 GHz
Maximum Data Rate	300 Mbps
Ports	Not applicable
Data Rate	Up to 300Mbps
Product Type	WiFi Adapter
Security	WPA, WPA2
Category	Wireless
Controller	Intel