Intel 5100 Series

Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 27
Thermal/Mechanical Reference Design
Note: The thermal specifications shown in this graph are for reference only. Refer to the Dual-
Core Intel
®
Xeon
®
Processor 5100 Series Datasheet for the Thermal Profile
specifications. In case of conflict, the data information in the datasheet supersedes any
data in this figure.
Table 2-4, Table 2-5 and Table 2-6 describe thermal performance target for the Dual-
Core Intel Xeon Processor 5100 Series cooling solution enabled by Intel.
Figure 2-11. Thermal Profiles A and B for the Dual-Core Intel
®
Xeon
®
Processor 5160
TCASE_MAX_B@TDP is a thermal solution design point. In actuality, units will
not significantly exceed TCASE_MAX_A due to TCC activation.
TCASE_MAX_B@TDP
TCASE_MAX_A@TDP
Thermal Profile B
Y = 0.282*x +42.4
Thermal Profile A
Y = 0.231*x +41.5
40
45
50
55
60
65
70
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
Power [W]
Temperature [C]
TCASE_MAX_B@TDP is a thermal solution design point. In actuality, units will
not significantly exceed TCASE_MAX_A due to TCC activation.
TCASE_MAX_B@TDP
TCASE_MAX_A@TDP
Thermal Profile B
Y = 0.282*x +42.4
Thermal Profile A
Y = 0.231*x +41.5
40
45
50
55
60
65
70
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
Power [W]
Temperature [C]
Table 2-4. Intel Reference Heatsink Performance Targets for the Dual-Core Intel®
Xeon® Processor 5148
Parameter Maximum Unit Notes
Altitude Sea-level m Heatsink designed at 0 meters
T
LA
40 ° C
TDP 40 W
T
CASE_MAX
58 ° C
T
CASE_MAX
@ P_profile_min 50 ° C P_profile_min = 22.2 W.
Airflow 15
25.5
CFM
m
3
/ hr
Airflow through the heatsink fins
Pressure Drop 0.331
82.4
Inches of H
2
O
Pa
ψ
CA
0.299 ° C/W Mean + 3σ