Intel 5100 Series User Manual

Thermal/Mechanical Reference Design
46 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Please refer to Appendix A for more detailed mechanical drawings of the CEK spring.
Also, the baseboard keepout requirements shown in Appendix A must be met to use
this CEK spring design.
2.4.8 Boxed Active Thermal Solution for the Dual-Core Intel
Xeon Processor 5100 Series
Intel will provide a 2U passive and a 1U passive / active heatsink solution for the boxed
Dual-Core Intel Xeon Processor 5100 Series. This active heatsink solution is primarily
designed to be used in a pedestal chassis where sufficient air inlet space is present and
side directional airflow is not an issue. This active heatsink solution consists of a 4 wire
PWM fan and a 1U passive heatsink compatible with 1U form factors both mechanically
and thermally. These solutions are intended for system integrators who build systems
Figure 2-23. CEK Spring Isometric View
Figure 2-24. Isometric View of CEK Spring Attachment to the Base Board
Secondary
Primary
Secondary
Primary

Intel 5100 Series Specifications

General

Wireless Protocol	802.11a/b/g/n
Frequency Band	2.4 GHz, 5 GHz
Maximum Data Rate	300 Mbps
Ports	Not applicable
Data Rate	Up to 300Mbps
Product Type	WiFi Adapter
Security	WPA, WPA2
Category	Wireless
Controller	Intel