Intel 5100 Series User Manual

Thermal/Mechanical Reference Design
42 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B
for the Dual-Core Intel
®
Xeon
®
Processor 5160. From Table 2-6 the three-sigma
(mean+3sigma) performance of the thermal solution is computed to be 0.299°C/W and
the processor local ambient temperature (T
LA
) for this thermal solution is 40°C. Hence,
the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-11.y = 0.299x + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-20 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Dual-Core Intel
®
Xeon
®
Processor 5160 Thermal Profile B specification.
The 1U CEK solution meets the Thermal Profile B with 1.9°C margin at the lower end
(P
_PROFILE_MIN
) and 1.1°C margin at the upper end (TDP). However, as explained in
Section 2.2.7, designing to Thermal Profile B results in increased TCC activation and
measurable performance loss for the processor.
Figure 2-19. 2U+CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5160 Thermal
Profile A
0
10
20
30
40
50
60
0 102030405060708090
Power [W]
Tcase [°C]
2U+ CEK Reference Solution
y = 0.236 * x + 40
TDP
T
CASE_MAX
@
P
_PROFILE_MIN
P
_PROFILE_MIN
T
CASE MAX_A
@
TDP
Thermal Profile A
y = 0.231 * x + 41.5
0
10
20
30
40
50
60
0 102030405060708090
Power [W]
Tcase [°C]
2U+ CEK Reference Solution
y = 0.236 * x + 40
TDP
T
CASE_MAX
@
P
_PROFILE_MIN
P
_PROFILE_MIN
T
CASE MAX_A
@
TDP
Thermal Profile A
y = 0.231 * x + 41.5

Intel 5100 Series Specifications

General

Brand	Intel
Model	5100 Series
Category	Computer Hardware
Language	English