Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 29
Thermal/Mechanical Reference Design
Note: In case of conflict, the processor datasheet supersedes the information contained in the TMDG.
2.3 Characterizing Cooling Solution Performance
Requirements
2.3.1 Fan Speed Control
Fan speed control (FSC) techniques to reduce system level acoustic noise are a
common practice in server designs. The fan speed is one of the parameters that
determine the amount of airflow provided to the thermal solution. Additionally, airflow
is proportional to a thermal solution’s performance, which consequently determines the
T
CASE
of the processor at a given power level. Since the T
CASE
of a processor is an
important parameter in the long-term reliability of a processor, the FSC implemented in
a system directly correlates to the processor’s ability to meet the Thermal Profile and
hence the long-term reliability requirements. For this purpose, the parameter called
T
CONTROL
as explained in Section 2.2.6, is to be used in FSC designs to ensure that the
long-term reliability of the processor is met while keeping the system level acoustic
noise down. Figure 2-12
depicts the relationship between T
CONTROL
and FSC
methodology.
Table 2-6. Intel Reference Heatsink Performance Targets for the Dual-Core Intel Xeon
Processor 5160
Parameter Maximum Unit Notes
Altitude Sea-level m Heatsink designed at 0 meters
T
LA
40 ° C
TDP 80 W
2U+ Reference Solution, Thermal Profile A
T
CASE_MAX_A
60 ° C
T
CASE_MAX
@ P_profile_min 50 ° C P_profile_min= 36.8 W.
Airflow 27
45.9
CFM
m
3
/ hr
Airflow through the heatsink fins
Pressure Drop 0.182
45.3
Inches of H
2
O
Pa
ψ
CA
0.236 ° C/W Mean + 3σ
1U Reference Solution, Thermal Profile B
T
CASE_MAX_B
(Profile B)
65 ° C
T
CASE_MAX
@ P_profile_min
(Profile B)
50 ° C P_profile_min = 27 W.
Airflow 15
25.5
CFM
m
3
/ hr
Airflow through the heatsink fins
Pressure Drop 0.331
82.4
Inches of H
2
O
Pa
ψ
CA
0.299 ° C/W Mean + 3σ
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