Intel 5100 Series User Manual

Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 3
Contents
1Introduction..............................................................................................................7
1.1 Objective ...........................................................................................................7
1.2 Scope................................................................................................................7
1.3 References.........................................................................................................7
1.4 Definition of Terms..............................................................................................8
2 Thermal/Mechanical Reference Design....................................................................11
2.1 Mechanical Requirements ...................................................................................11
2.1.1 Processor Mechanical Parameters ............................................................. 11
2.1.2 Dual-Core Intel Xeon Processor 5100 Series Processor Package.................... 11
2.1.3 Dual-Core Intel Xeon Processor 5100 Series Considerations ......................... 14
2.2 Processor Thermal Parameters and Features......................................................... 15
2.2.1 Thermal Control Circuit and TDP............................................................... 15
2.2.2 Digital Thermal Sensor............................................................................ 16
2.2.3 Platform Environmental Control Interface (PECI) ........................................16
2.2.4 Multiple Core Special Considerations......................................................... 17
2.2.5 Thermal Profile ...................................................................................... 20
2.2.6 TCONTROL Definition..............................................................................22
2.2.7 Thermal Profile Concepts for the
Dual-Core Intel Xeon Processor 5100 Series............................................... 23
2.2.8 Performance Targets...............................................................................25
2.3 Characterizing Cooling Solution Performance Requirements..................................... 29
2.3.1 Fan Speed Control..................................................................................29
2.3.2 Processor Thermal Characterization Parameter Relationships........................ 31
2.3.3 Chassis Thermal Design Considerations..................................................... 33
2.4 Thermal/Mechanical Reference Design Considerations ............................................33
2.4.1 Heatsink Solutions..................................................................................33
2.4.2 Thermal Interface Material.......................................................................34
2.4.3 Summary..............................................................................................35
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 35
2.4.5 Thermal Solution Performance Characteristics............................................ 37
2.4.6 Thermal Profile Adherence.......................................................................39
2.4.7 Components Overview ............................................................................43
2.4.8 Boxed Active Thermal Solution for the
Dual-Core Intel Xeon Processor 5100 Series .............................................. 46
A Mechanical Drawings...............................................................................................51
B Heatsink Clip Load Methodology ..............................................................................73
B.1 Overview .........................................................................................................73
B.2 Test Preparation................................................................................................73
B.2.1 Heatsink Preparation ..............................................................................73
B.2.2 Typical Test Equipment ...........................................................................76
B.2.3 Test Procedure Examples ........................................................................ 76
B.2.4 Time-Zero, Room Temperature Preload Measurement .................................76
B.2.5 Preload Degradation under Bake Conditions ...............................................77
C Safety Requirements ............................................................................................... 79
D Quality and Reliability Requirements....................................................................... 81
D.1 Intel Verification Criteria for the Reference Designs................................................ 81
D.1.1 Reference Heatsink Thermal Verification....................................................81
D.1.2 Environmental Reliability Testing..............................................................81
D.1.3 Material and Recycling Requirements ........................................................83
E Enabled Suppliers Information ................................................................................ 85

Intel 5100 Series Specifications

General

Brand	Intel
Model	5100 Series
Category	Computer Hardware
Language	English