Intel 5100 Series User Manual

Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 39
Thermal/Mechanical Reference Design
2.4.6 Thermal Profile Adherence
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for
the Dual-Core Intel
®
Xeon
®
Processor 5148. From Table 2-4 the three-sigma
(mean+3sigma) performance of the thermal solution is computed to be 0.299°C/W and
the processor local ambient temperature (T
LA
) for this thermal solution is 40°C. Hence,
the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-8.y = 0.299x + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Table 2-17 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Dual-Core Intel
®
Xeon
®
Processor 5148 Thermal Profile specification. The
1U CEK solution meets the Thermal Profile with 3.4°C margin at the lower end
(P
_PROFILE_MIN
) and 6.0°C margin at the upper end (TDP). By designing to Thermal
Profile, it is ensured that no measurable performance loss due to TCC activation is
observed under the given environmental conditions.
Figure 2-16. 1U CEK Heatsink Thermal Performance
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0 1020304050
CFM Through Fins
Ψ
ca
, C/W
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
Δ
P, inch water
Mean
Ψ
ca
= 0.1831 + 1.1113*CFM
-0.8634
σ
= 0.0028 C/W
Δ
P = 2.73e-04CFM
2
+ 1.86e-02CFM
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0 1020304050
CFM Through Fins
Ψ
ca
, C/W
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
Δ
P, inch water
Mean
Ψ
ca
= 0.1831 + 1.1113*CFM
-0.8634
σ
= 0.0028 C/W
Δ
P = 2.73e-04CFM
2
+ 1.86e-02CFM

Intel 5100 Series Specifications

General

Wireless Protocol	802.11a/b/g/n
Frequency Band	2.4 GHz, 5 GHz
Maximum Data Rate	300 Mbps
Ports	Not applicable
Data Rate	Up to 300Mbps
Product Type	WiFi Adapter
Security	WPA, WPA2
Category	Wireless
Controller	Intel