Intel 5100 Series User Manual

Thermal/Mechanical Reference Design
40 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for
the Dual-Core Intel Xeon Processor 5110/5120/5130/5140/5150. From Table 2-5 the
three-sigma (mean+3sigma) performance of the thermal solution is computed to be
0.299 °C/W and the processor local ambient temperature (T
LA
) for this thermal solution
is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-9.y = 0.299x + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-18 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Dual-Core Intel Xeon Processor 5110/5120/5130/5140/5150 Thermal
Profile specification. The 1U CEK solution meets the Thermal Profile with 2.2°C margin
at the lower end (P
_PROFILE_MIN
) and 5.6°C margin at the upper end (TDP). By
designing to Thermal Profile, it is ensured that no measurable performance loss due to
TCC activation is observed under the given environmental conditions.
Figure 2-17. 1U CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5148 Thermal
Profile
0
5
10
15
20
25
30
35
40
45
50
55
60
65
0 5 10 15 20 25 30 35 40 45
Power [W]
Tcase [°C]
1U CEK Reference Solution
y = 0.299 * x + 40
TDP
T
CASE_MAX
@
P
_PROFILE_MIN
P_
PROFILE_MIN
T
CASE MAX
@
TDP
Thermal Profile
y = 0.450 * x + 40
0
5
10
15
20
25
30
35
40
45
50
55
60
65
0 5 10 15 20 25 30 35 40 45
Power [W]
Tcase [°C]
1U CEK Reference Solution
y = 0.299 * x + 40
TDP
T
CASE_MAX
@
P
_PROFILE_MIN
P_
PROFILE_MIN
T
CASE MAX
@
TDP
Thermal Profile
y = 0.450 * x + 40

Intel 5100 Series Specifications

General

Brand	Intel
Model	5100 Series
Category	Computer Hardware
Language	English