Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 43
Thermal/Mechanical Reference Design
2.4.7 Components Overview
2.4.7.1 Heatsink with Captive Screws and Standoffs
The CEK reference heatsink uses snapped-fin technology for its design. It consists of a
copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The
mounting screws and standoffs are also made captive to the heatsink base for ease of
handling and assembly as shown in Figure 2-21 and Figure 2-22 for the 2U+ and 1U
heatsinks, respectively.
Note: Refer to Appendix A for more detailed mechanical drawings of the heatsink.
Figure 2-20. 1U CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5160 Thermal
Profile B
0
10
20
30
40
50
60
70
0 1020304050607080
Power [W]
Tcase [°C]
1U CEK Reference Solution
y = 0.299 * x + 40
TDP
T
CASE_MAX
@
P
_PROFILE_MIN
P
_PROFILE_MIN
T
CASE MAX_B
@
TDP
Thermal Profile B
y = 0.282 * x + 42.4
0
10
20
30
40
50
60
70
0 1020304050607080
Power [W]
Tcase [°C]
1U CEK Reference Solution
y = 0.299 * x + 40
TDP
T
CASE_MAX
@
P
_PROFILE_MIN
P
_PROFILE_MIN
T
CASE MAX_B
@
TDP
Thermal Profile B
y = 0.282 * x + 42.4
Figure 2-21. Isometric View of the 2U+ CEK Heatsink
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