Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 19
Thermal/Mechanical Reference Design
Notes:
1. X=1,2, represents any one of the core1and core2 in Dual-Core Intel Xeon Processor 5100 Series.
2. For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Dual-Core Intel® Xeon®
Processor 5100 Series Datasheet.
2.2.4.5 Heatpipe Orientation for Multiple Core Processors
Thermal management of multiple core processors can be achieved without the use of
heatpipe heatsinks, as demonstrated by the Intel Reference Thermal Solution discussed
in Section 2.4.
To assist customers interested in designing heatpipe heatsinks, processor core
locations have been provided. In some cases, this may influence the designer’s
selection of heatpipe orientation. For this purpose, the core geometric center locations,
as illustrated in Figure 2-4, are provided in Table 2-3. Dimensions originate from the
vertical edge of the IHS nearest to the pin 1 fiducial as shown in Figure 2-4.
Table 2-2. Input and Output Conditions for the Dual-Core Intel Xeon Processor 5100
Series Thermal Management Features
Item Processor Input Processor Output
TM/TM2 DTSCore X > TCC Activation Temperature All Cores TCC Activation
PROCHOT# DTSCore
X > TCC Activation Temperature PROCHOT# Asserted
THERMTRIP# DTSCore
X > THERMTRIP # Assertion
Temperature
THERMTRIP# Asserted,
all cores shut down
FORCEPR# FORCEPR# Asserted All Cores TCC Activation