Intel D850MVSE - Manufacturing Options

Product Description
13
Table 2. Feature Summary (continued)
Hardware Monitor
Subsystem
• Voltage sense to detect out-of-range power supply voltages
• Thermal sense to detect out-of-range thermal values
• Fan control and monitoring
Hardware
Monitoring Features
Two fan sense inputs used to monitor fan activity
Audio (Integrated)
Audio subsystem that uses the Analog Devices AD1885 analog codec for AC ’97
processing
For information about Refer to
The board’s compliance level with APM, ACPI, Plug and Play, and SMBIOS. Section 1.5, page 19
1.2.2 Manufacturing Options
Table 3 describes the D850MD and D850MV boards’ manufacturing options. Not every
manufacturing option is available in all marketing channels. Please contact your Intel
representative to determine which manufacturing options are available to you.
Table 3. Manufacturing Options
Video
AGP Pro50 interface (50 W maximum); backward compatible with 1.5 V AGP
video cards.
This option uses an AGP Pro 1.5 V connector, also known as an AGP Pro50
connector.
LAN
Intel
®
82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device
CNR
One Communication and Networking Riser (CNR) connector (slot shared with
PCI bus connector 3 on the D850MD board and with PCI bus connector 5 on the
D850MV board)
USB 2.0
Support for USB 2.0 devices. The USB 2.0 option supports up to five USB ports
and is currently available only on the D850MV board. It uses the following
components:
• NEC
µPD720100 USB 2.0 host controller
• SMSC LPC47M132 LPC bus I/O controller
The USB 1.1 ports routed through the ICH2 are not available with the USB 2.0
option.
✏
NOTE
The LAN and the CNR manufacturing options are mutually exclusive.