Intel D850MVSE - Audio Subsystem; Audio Subsystem Block Diagram

Product Description
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1.10 Audio Subsystem
The audio subsystem includes these features:
• Split digital/analog architecture for improved signal-to-noise (S/N) ratio: ≥ 85 dB
• Power management support for APM 1.2 and ACPI 1.0 (driver dependant)
• 3-D stereo enhancement
The audio subsystem supports the following audio interfaces:
• ATAPI-style connectors:
 CD-ROM
 Auxiliary line in
• Back panel audio connectors:
 Line out
 Line in
 Mic in
The audio subsystem consists of the following devices:
• Intel 82801BA ICH2
• Analog Devices AD1885 analog codec
Figure 9 is a block diagram of the audio subsystem.
82801BA
I/O Controller Hub
(ICH2)
OM12338
AC ’97
Link
AD1885
Audio Codec
Auxiliary Line In
Mic In
Line Out
CD-ROM
Line In
Figure 9. Audio Subsystem Block Diagram
For information about Refer to
The location and signal names of the back panel audio connectors Section 2.8.1, page 54