Technical Reference
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Table 52 provides maximum case temperatures for D850MD/D850MV board components that are
sensitive to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when considering
proper airflow to cool the D850MD and D850MV boards.
Table 52. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Pentium 4 processor For processor case temperature, see processor datasheets and
processor specification updates
Intel
82850 MCH 105
o
C (under bias)
Intel 82801BA ICH2 109
o
C (under bias)
For information about Refer to
Intel Pentium 4 processor datasheets and specification updates Section 1.3, page 18
2.13 Reliability
The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC.
D850MD and D850MV board MTBF: 110595.61 hours
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