Mode of operation
MultiPress S Operating manual 3.0 Rev 3.6.2009 35
Curing stage (5) After its removal, the multilayer must rest at room temperature for at least
16 h, to allow the adhesive to cure completely.
Note: An incompletely cured adhesive can smear the inner layers during
drilling, thus no longer guaranteeing proper through-hole plating.
5.1.2 Configuration
The MultiPress S is equipped with a permanently configured LPKF press
profile and six freely configurable profiles.
LPKF Set The press profile LPKF Set can be used for standard multilayers
comprising 4,6 and 8 layers of layout 200 x 275 mm (7.87“ x 10.83“)
. To
guarantee optimum processing at the parameters listed in table 1, the
base material must have a size of 305 x 229 mm (12" x 9").
Variable profiles The press profiles available for individual configuration Profile 1 –
Profile 6 have been preset to the parameters listed in table 1. In this way,
depending on the requirements, only few changes must be made.
Tab. 1: Preset pressing
parameters
Tip: Write down the parameters that you have changed. The Appendix
contains a table in which you can enter the parameters required for
your applications.
Parameters LPKF 1
Profile 1 – Profile 8
Preheating temperature 250 °C 250 °C
Prepressing temperature 180 °C 150 °C
Main pressing temperature 180 °C 180 °C
Prepressing time 10 min 10 min
Main pressing time 60 min 30 min
Prepressing force 80 N/cm² 80 N/cm²
Main pressing force 150 N/cm² 100 N/cm²
Width 305 mm 305 mm
Height 229 mm 229 mm
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